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Winbond release 2Gb+2Gb NAND+LPDDR4x multi-chip package - Embedded.com
Winbond Electronics launch a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memory product in a compact 8.0 x 9.5 x 0.8mm multi-chip package (MCP). The new
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