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Convenient chips but even more inconvenient packages – Fail, fail, fail and fail again: Trying to solder the TPA2011D1 speaker amplifier
I was doing some prototyping of the TI TPA2011D1 3 watt Class-D amplifier that’s in a 1.2 x 1.2 mm 9-ball BGA package. Unlike my tries with the bq27421, these chips are downright painful to s…