IC Manufacture, Steps & Raw Material | HAMBO ELEKTRONIK
The structure of the IC is very complex both in terms of surface topography and its internal composition. Each element in a device has a three-dimensional architecture that must be produced equally for each series. Each component is a structure consisting of many layers, each of which has a specific pattern. Some layers are embedded in silicon and some are piled on top of it. The IC manufacturing process requires an exact work order and careful circuit design is needed.
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